
Low temperature curing epoxy adhesive
Low temperature curing epoxy adhesive is an adhesive that can cure quickly at low temperature without damaging heat resistant precision electronic components.
Generally speaking, low temperature curing epoxy adhesive has excellent adhesion to most substrates and a wide range of applications.
As an adhesive manufacturer, AVENTK not only produces UV glue, but also produces low temperature curing epoxy glue, heating curing glue and other types of adhesives.
Today, AVENTK will share with you the characteristics of low temperature curing epoxy adhesive and applicable industry, interested friends will go on to see!
The bonding process of epoxy adhesives is a complex physical and chemical process, including wetting, bonding, curing and other steps. Finally, the curing product with three-dimensional crosslinked structure is produced, and the bonded material is integrated.
The curing temperature of one-component epoxy adhesive is generally 120℃-130℃, but with the development of miniaturization and precision of electronic technology.
The relatively high 120℃ curing conditions are increasingly unsuitable for many precision electronic components and LED components, which is the main reason why low temperature curing adhesives are widely used.
Low temperature curing epoxy adhesive features
Compared with high temperature curing glue, AVENTK low temperature curing epoxy glue has the following characteristics:
1. Excellent adhesion and adhesion to most materials;
2. High and low temperature resistance, high temperature through SMT reflow soldering/wave soldering;
3. Impact resistance, aging resistance, can pass the double 85 condition test;
4. Minimal linear expansion coefficient and volume shrinkage rate;
5. Long preparation operation time, good environmental adaptability, fast curing within 10 minutes, meet the high efficiency of production.
Applicable industry
1. In the field of optics, shading, sealing and fixing of optical lenses, charge-coupled devices/CMOS and camera modules;
2. In the field of chips, IC/ chip BGA package fixed, bottom filling protection and reinforcement;
3. Bonding and fixing protection of LED components, such as PC lens, LED backlight strip, lamp pearl source, etc.;
4.PCB/FPC, circuit board field, heat resistant circuit board components fixed, sealed and confidential protection;
5. In the field of sensors, some precision sensors, such as heat-sensitive temperature sensors, are protective and sealed;
6. Sealing, protection and bonding of precision electronic components. For example, some electronic relays are made of materials that are not resistant to high temperature.
UV glue related questions to AVENTK
AVENTK has been committed to providing customers with high quality, rapid adhesive curing solutions that meet the requirements of strict environmental protection and industrial automation for many years.
Our products include UV curable glue, low temperature thermal curable glue, hot melt glue, catalyst curable glue and UVLED curing equipment for camera modules, security products, PCBA coating, loudspeakers, electronic assembly, medical, optical fiber devices, printing, inkjet and other industries.
AVENTK works hand in hand with customers to provide customized solutions that are carefully discussed, carefully designed and repeatedly verified with each customer to ensure that the final product not only meets the performance requirements of the specific application, but also integrates into the customer's process flow to solve problems simply and efficiently.