Cell phone camera module with glue

Camera module is written as CCM. it consists of lens set, voice coil motor, filter, sensor, circuit board, FPC connector and other components, each component has its own role. Among them, lens set (LENS), image processing chip (DSP), sensor (SENSOR) are the key components to determine the merits of a camera.

AVENTK, as an electronic adhesive manufacturer, in the development of adhesives for camera module glue point, but also on the camera module structure to carry out a rigorous and exhaustive understanding and study. 

Today's cell phone development direction is mainly lightweight and multifunctional, thanks to Moore's Law as the representative of the chip integration technology and advanced packaging technology, to meet the device in the increase in functionality at the same time, more lightweight. 

The glue used in the chip package or module has a great impact on the performance and reliability of the final product, so no matter which packaging method is used, it is necessary to consider the difficulties of dispensing glue at each glue point.

Difficulties in dispensing glue

The main difficulties in gluing cell phone camera modules are as follows,

1. complicated glue points: the internal structure of cell phone camera module is complex and precise, many components need to be dispensing process to complete the dispensing, a rough estimate of roughly more than 30 glue points.

2. Diversified bonding materials: cell phone camera module needs to be bonded to a variety of materials, including LCP, PET, PC, PBT, PA, FR4, ceramics, glass, etc., different materials and requirements need to be applied to different glues.

3. Complex requirements: cell phone camera module internal bonding requirements and purposes of different points. 

Such as the lens and the lens base bonding adhesive, low shrinkage, low stress, non-leakage, fast curing; filter fixed bonding adhesive, the requirements of low-temperature curing, able to bond glass and plastic; lens base and substrate bonding, FPC and substrate bonding, the requirements of the glue can be a low-temperature curing and high strength; 

sensors, substrate bonding, chip bonding, the requirements of good mobility, high reliability; lens bonding barrel, the requirements of fast curing; 

Stiffener reinforcement glue, the requirements of different materials and requirements need to be applied differently. Curing; Stiffener reinforcement, required to connect the iron shell sealing and can conduct current VCM; 

voice coil motor requires adhesive with low stress and resistance to hot and cold shock characteristics, able to withstand the coefficient of thermal expansion of the two materials are very different, in line with the vibration of the next demand and so on.

AVENTK adhesives cover a wide range of adhesive points for cell phone camera modules.

To address the difficulties in gluing cell phone camera modules, AVENTK has developed and produced a series of camera module adhesives, including UV adhesives, epoxy adhesives, thermosetting adhesives, UV thermosetting adhesives, UV moisture curing adhesives and other types of adhesives. 

AVENTK can provide the following cell phone camera module adhesive program, if you have a cell phone camera module adhesive needs, welcome to contact AVENTK communication:

Lens and lens base fixing adhesive: After adjusting the focal length of the lens and lens base, it needs to be fixed with UV adhesive to prevent the malfunction caused by the change of focal length.

Lens Bonding Adhesive: UV adhesive is mainly used for lens bonding, in order to avoid the glue flowing into the opaque gap when it is not cured, the viscosity and thixotropy of the glue used need to meet certain requirements.

Lens and lens barrel fixation adhesive: need to use fast curing UV adhesive, YASKAWA new material lens bonding adhesive series adhesive with fast curing, good toughness, impact resistance, high temperature and high humidity resistance, superior reliability and stability, etc., and at the same time, the high thixotropic index can reduce the migration of liquids and harmful substances.

Filter Fixing Adhesive: To fix the filter with the lens base, it is necessary to apply a UV adhesive with a width of 0.2~0.3mm to fix it. Filter bonding will be used to the UV adhesive will be low-temperature thermosetting or UV heating double curing, the way mainly depends on the final structural design.

Voice coil motor encapsulation adhesive: voice coil motor with more adhesive points, structural design determines the final choice.

Mainly bonding coil and bracket, magnet fixing, shrapnel and other electronic components fixed, usually using low-temperature curing adhesive fixed. Such as conductive silver adhesive commonly used in voice coil motor and spring electrical connection, voice coil motor terminal connection, side reinforcement sealing and so on.

Sensor and substrate fixing adhesive: photoreceptor chip is large, requires low warpage, needs to have high reliability, good storage stability, bonding strength and electrical properties.

Usually use low-temperature thermosetting adhesive, through the bottom of the filler adhesive for the bottom of the dispensing filler to enhance the reliability of the chip.

Flexible circuit board reinforcement adhesive: Flexible circuit board through the UV adhesive dispensing to reinforce, used to connect the iron shell to increase the sealing and conduction current.

Mirror holder bracket and substrate fixed adhesive: mainly to strengthen the flexible circuit board and substrate connection. There are two kinds of adhesive for mirror holder bracket and mirror holder.

For fixed-focus cameras generally use low-temperature heat-curing adhesive, for zoom cameras generally use UV + heating dual-curing adhesive, UV + heating dual-curing adhesive is a dual-curing adhesive with UV and heat-curing ability, and can be applied to the active alignment process, referred to as the AA process.

The AA process is a technology that determines the relative position of parts in the assembly process. When assembling each part of the camera, the AA equipment will detect the semi-finished product being assembled and actively align the semi-finished product according to the actual situation of the semi-finished product being assembled, and then assemble the next part into place.

Although LENS, DSP and SENSOR are the decisive factors in camera modules, the goodness of auxiliary materials such as glue and whether the processing flow is standardized can also greatly affect the final result.

AVENTK as a professional adhesive production provider, specializing in electronic adhesive R & D and manufacturing, to provide customers with the whole process involved in the solution mechanism.

After years of development, there are now a series of products can meet customer requirements for camera modules to provide lightweight, multifunctional and at the same time safe and reliable, able to find the most suitable adhesive solutions for you.