Low temperature curing epoxy adhesive
Low temperature curing epoxy adhesive refers to an adhesive that can be cured quickly at a lower temperature without damaging heat-resistant precision electronic components. Generally speaking, low temperature curing epoxy adhesives have excellent adhesion to most substrates and are suitable for a wide range of applications. As an adhesive manufacturer, AVENTK not only produces UV glue, but also produces various types of adhesives such as low temperature curing epoxy glue and heat curing glue. Today, AVENTK will share with you the characteristics and applicable industries of low temperature curing epoxy adhesive. Interested friends will continue to read it!
The bonding process of epoxy adhesive is a complex physical and chemical process, including wetting, bonding, curing and other steps, and finally produces a cured product with a three-dimensional cross-linked structure, which combines the adherends into one. The curing temperature of one-component epoxy adhesives is generally 120℃-130℃, but with the development of miniaturization and precision of electronic technology, the relatively high curing conditions of 120℃ are more and more unsuitable for many precision electronic components and LED components, which is the main reason why low temperature curing adhesives are widely used.
Features of low temperature curing epoxy adhesive
Compared with high temperature curing glue, AVENTK low temperature curing epoxy glue mainly has the following characteristics:
1. Excellent adhesion and adhesion to most materials;
2. High and low temperature resistance, can pass SMT reflow soldering/wave soldering high temperature;
3. Impact resistance, aging resistance, can pass the double 85 condition test;
4. Minimal coefficient of linear expansion and volume shrinkage;
5. The preparation operation time is long, the environmental adaptability is good, and the curing time is fast within 10 minutes, which can meet the efficient production.
Applicable industries
1. In the field of optics, shading, sealing and fixing of optical lenses, charge coupled devices/complementary metal oxide semiconductors and camera modules;
2. In the chip field, IC/chip BGA package fixation, underfill protection and reinforcement;
3. Bonding and fixing protection of LED components, such as PC lens, LED backlight strip, lamp bead light source, etc.;
4. PCB/FPC, circuit board field, fixing, sealing and confidentiality protection of heat-resistant circuit board components;
5. In the sensor field, some precision sensors, such as thermal temperature sensors, are protected and sealed;
6. Sealing, protection and bonding of precision electronic components, such as some electronic relays are made of materials that are not resistant to high temperature.
For UV glue related problems, find AVENTK
AVENTK has been committed to providing customers with high-quality, fast adhesive (UV) curing solutions that meet strict environmental protection requirements and meet the needs of industrial automation production for many years. Products include UV curing glue, low temperature heat curing glue, hot melt glue, catalyst curing glue and UVLED curing equipment.
AVENTK works with customers to provide customized solutions, carefully discussed with each customer, carefully designed, and repeatedly verified to ensure that the final product not only meets the performance requirements of specific applications, but also can be integrated into the customer's process flow to solve problems simply and efficiently. .
